The machine can use UV or green laser cutting for PCB cutting and separation according to requirements. It can precisely cut and shape various types of PCBs with V-CUT and via-in-pad (VIP) features, create windows and openings, and separate both encapsulated and regular bare boards. The equipment supports automatic loading and unloading for cutting, allowing for the entire sheet of material to be loaded and unloaded at once, and it can also process single pieces for collection.
: High-performance UV/green laser for precise, narrow cuts.
: Dust-free process to avoid circuit conductive failures.
: Contact-free separation of assembled PCBs.
: Two-axis platform ensures accuracy and speed.
: Software controls with real-time process feedback.
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RS-UVC20-50 |
RS-GVC35-60 |
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355nm |
532nm |
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10-20W |
35W/40W/60W |
| ±2μm | ±2μm | |
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±1μm |
±1μm |
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400mmX300mm |
400mmX300mm |
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±3μm |
±3μm |
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40х40mm |
110х110mm |
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±1μm |
±1μm |
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<30μm |
<30μm | |
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<50μm |
<50μm |
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220V 50/60Hz |
220V 50/60Hz |
Suitable for cutting various types of PCB substrates, such as ceramic substrates, rigid-flex boards, FR4, PCBs, FPCs (flexible printed circuits), fingerprint recognition modules, cover films, composite materials, copper substrates, and aluminum substrates.

1.2mm PCB Laser Cutting

1.6mm PCB Laser Cutting

1.5mm Copper-Clad PCB Laser Cutting

V-CUT PCB Laser Cutting

1.6mm FR4 Laser Cutting

Cool tags: High-precision PCB Laser Cutting Machine


